Description
MA ANT Desoldering Braid BGA Soldering Suction Wire No-Clean Desoldering Wire Solder Wick Remover – MY-2515
- Prevent Short Circuit: Desoldering wire can absorb the tin stuck on the pins to ensure that there is no short circuit between the pins. It can also be used to clean the pads of BGA components
- Quality Material: Solder braid wire is made of premium copper wire, oxidation and corrosion resistance, excellent thermal conductivity and tin absorption
- Flat Knitting: Fast heat conduction, suitable for fast tin absorption to reduce the risk of thermal damage to the circuit board
- No-Clean Design: Tin remover desoldering wick is effective in removing and absorbing solder, and leaves almost no residue after use, no need to clean, convenient and fast
- Different Sizes: Choose the right size to meet your different desoldering requirements. Suitable for desoldering of printed circuit boards, computer motherboards, cell phone boards, etc.
- Storage environment: sealing and avoiding light, dry and moisture-proof
Instructions:
- 1. For the solder that needs to be removed, place an appropriate length of solder suction line on the cleaned solder return point, and then gently press and heat it with an electric soldering iron nozzle. Once the solder melts, it will be absorbed by the solder suction line.
- 2. Once the solder is absorbed, please remove both the soldering wire and the soldering wire simultaneously.
- 3. Please use scissors to cut off the used solder wire.
Package included:
- 1 x Desoldering Wire
- Other items not include
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